Fig. 2
From: Optimizing the fabrication of a 3D high-resolution implant for neural stimulation
Illustration of the final optimized fabrication process of a SU-8-gold high resolution, high aspect-ratio device. I) Ni thin-layer deposition. II) SU-8 spin coating, soft bake. III) UV exposure and PEB. IV) Development (PGMEA), curing and O2 plasma. V) LOR spin coating, baking, AZ photoresist spin coating, soft bake, and UV exposure. VI) AZ development (AZ351, AZ curing, and LOR development. VII) O2 plasma, Ar ion-milling, and Cr/Au (10/200Â nm) metallization by thin-layer sputter deposition. VIII) Bi-layer lift-off (NMP). IX) 2nd SU8 layer spin coating, soft bake, and UV exposure. X) PEB, SU-8 development (PGMEA) and curing, XI) wet etch release (HNO3), and XII) RGD bio-functionalization by immersion